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Heat transfer tape without adhesive AGThermopad 20x130x2mm, 2.4 W/mK art.AGT-138
Heat-conductive silicone backing. For mounting heatsinks on heat-producing electronic components. Thickness 2 mm, strip 20 x 130 mm. Producer: AG TermoPasty, Poland.
AG TermoPasty art.AGT-138 Thermally conductive tape without glue AGThermopad 20x130x2mm, 2.4 W /mK
Thermally conductive tapes are used where it is impossible to use thermally conductive paste.
The material is highly compressible, which ensures good thermal contact between the mating surfaces of parts that require cooling.
The silicone base gives the material high elasticity, the substrate well fills the microrelief of mating surfaces.
Without an adhesive layer, during installation it is necessary to ensure mechanical fixation and pressing of the elements.
Application:
Fills micro-roughnesses between contacting elements to ensure heat transfer.
thermal conductivity coefficient at a temperature of 0-150°C, (W/m)*K: >2.4
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
To carry out technical calculations and obtain the exact parameters of the goods, use the datasheets from the manufacturer's website.
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The data presented in the product description are for reference only and may differ from those indicated by the manufacturer.
